MCP2-8-S Mechanical Pick Spatula

An edge-grip normally closed (consistent force) edge exclusion mechanical pick for handling round substrates from the wafer edge. The wafer contact pad is a per-fluorinated O-ring strip for

grip/hold on the wafer without scratching or leaving out-gassing behind. The knife-edge gripper is replaceable. Commonly used where double-sided wafers are being handled also in application labs and for wafer rescue applications.

The MCP2-8-S Features: 

A knife-edge spatula tip for lifting the wafer from a flat surface or single

wafer carrier

Dimensions 7.18" x 2.12" x .7"

Weight 0.25 lbs

Cleanroom compatibility         ISO class 5

Contact material: Lid         ESD Poly

Contact Material: Stop pins          PVDF

Contact Material: I-ring            Perfluorinated compound