MCP2-23-S Mechanical Pick Spatula

An edge-grip normally closed (consistent force) edge exclusion mechanical pick for handling round substrates from the wafer edge. The wafer contact pad is a per-fluorinated O-ring strip for grip/hold on the wafer without scratching or leaving out-gassing behind. The knife-edge gripper is replaceable. Commonly used where double-sided wafers are being handled also in application labs and for wafer rescue applications.

The MCP2-23-S Features: 

A knife-edge spatula tip for lifting the wafer from a flat surface or single

wafer carrier

Wafer Size 50, 76

Dimensions 7.2" x 1.4" x .7"

Weight 0.25 lbs