OSTRICON

Ostricon Family of Contacting Technology

Ostricon is a unique cantilever style contacting solution which is designed for flexibility to match various loadboard footprints and test handler hardware.

• Cantilever style  with X-Direction Off-set Contact technology (IC package and load board ends are not in vertical alignment)
  
• Optional TCC enables ability to maintain ±2⁰C from set point at DUT during test

Features and benefits

Cantilever Pins (Non-Kelvin):

• Capable testing current up to 25Amp/pin. Pulse & voltage up to 7.5KC or more

Unique Pins Profile:

• Flexibility to match various loadboard foorprint

Sustainable 1st   Pass Yield (FPY):

• Superior Signal Performance
  

SWS (Short Wiping Stroke) Technology:

• Ideal for Short Pads, Chamfered Corner Pads, and Wettable Flank and Step Cut Styles
  

TrI-Temperature:

• Thermal Conditional Channel (TCC) design to maintain ± 2°C test temperature
  

TCC (Thermal Conditioning Channel) Technology: 

• Maintains Thermal Set Point of Device during Test Process