GAMMA

Gamma Family of Contacting Technology

Gamma™ : Off-set (IC package and load board ends are not in vertical alignment) High Performance Test Contacting solution for the initial lab characterization through high-volume production test environments. 

• Cantilever style  with X-Direction Off-set Contact technology (IC package and load board ends are not in vertical alignment)
  
• Available in Full-Kelvin, Dedicated/Selected-Kelvin, and Non-Kelvin configurations
  
• Optional TCC enables ability to maintain ±2⁰C from set point at DUT during test

Features and benefits

Mechanical robustness:

• Rated for hundreds of thousands of IC package insertions for high-volume production test environment    

Thermal Conditioning Channels (TCC) Technology:

• Ability to efficiently thermal condition IC package and test contactor components to maintain ± 2°C test temperature

Versatile and cost effective:

• Easy replacement of contacts to reduce MTBA, improving up-time and lowering cost-of-test

Short Wiping Stroke (SWS) Technology:

• Micro-wipe provides consistent performance results while minimizing debris generation. Ideal for today's shorter lead geometry configurations

Advance Contact Finish (ACF) Technology:

• Extends maintenance intervals by reducing plating transfer buildup and loose debris